Zarlink Simplifies Design of Hands-Free Systems by Integrating Codecs with High-Quality Voice Processing Algorithms
- ZL(TM)38003 acoustic echo canceller reduces design complexity and component cost
OTTAWA, Nov. 16 /PRNewswire-FirstCall/ - Zarlink Semiconductor (NYSE: ZL) (TSX: ZL) today introduced the second in a family of voice processing devices that improves voice quality and reduces noise in a wide range of hands- free communication applications, including car kits, desktop phones and intercom systems.
The ZL38003 AEC (acoustic echo canceller) builds on a field-proven algorithm designed to track and reduce background noise and preserve voice quality in high-noise environments. The chip offers hands-free equipment designers an integrated solution that reduces design complexity, component costs and board space requirements.
"Voice quality often suffers when designers strike a balance between system cost, design complexity and integration concerns," said Andre Coucopoulos, marketing manager, Voice Processing, Zarlink Semiconductor. "The ZL38003 chip bundles a proven algorithm that handles hands-free voice performance issues, such as double-talk problems that often plague competing solutions, with features that meet design cost and integration demands."
Integrated features simplify design
The ZL38003 AEC's integrated features, including codecs, programmable gain pads and a four-port cross-point switch, eliminate the need for many external components.
The chip's two 16-bit linear codecs deliver performance that exceeds competing a/law and u/law codec designs by achieving better algorithm and acoustic echo cancellation performance, lower noise level, and fewer non- linearity effects.
When used in a desktop phone design, the integrated four-port cross-point switch allows the analog signal to be directed to any of the four ports which can be connected to a headset, speaker, ringer and audio jacks. The integrated switch saves design time and board space by eliminating the need to include and configure an external device.
The programmable gain feature allows the user to adjust a wide range of transducer sensitivities, with two microphone amplifiers and four earpiece amplifiers enabling connection to a handset, headset, auxiliary channel and microphone/speaker.
Advanced algorithm for high-noise situations
The AEC's patented software algorithms continuously track changes in the echo path, even during double-talk conditions, and reduce background noise while preserving high voice quality. The chip's full-duplex operation, even when voice signals are low, enables a natural two-way voice conversation. The non-linear processor supports full-duplex speech with no switched loss of the signal path.
Programmable noise reduction allows the user to adjust the noise reduction level to meet system requirements without distorting the audio signal. Zarlink's AEC algorithm converges during double-talk situations when both callers are speaking at the same time.
The ZL38003 acoustic echo canceller integrates other features to ensure high sound quality, including anti-howling detection that identifies instability in the audio path and automatically avoids oscillation.
Growing market for hands-free technology
Zarlink's voice processing technology meets the performance requirements of the fast-growing hands-free car-kit market. The ZL38003 chip is supported by reference designs, evaluation kits and online test files simulation.
Similarly, desktop phones and videoconference systems supporting hands-free communications will be a major portion of the growing phone market. Zarlink's ZL38003 device enhances sound quality and reduces background noise in multi-size conference rooms, with a tunable algorithm to support a variety of phone enclosure designs.
Security networks and intercom systems can take advantage of improved voice quality to support voice authentication and recognition applications to ensure faster emergency response.
For more about Zarlink's voice processing technology, visit http://voiceprocessing.zarlink.com/ . Additional information on Zarlink's voice processing technology, including reference designs and test algorithms, is available to qualified customers. To learn how to become a qualified customer, please send an email to Email Contact . Alternatively, please contact your local sales representative.
Availability, packaging and price
The ZL38003 device is now available in an 81-ball CABGA (chip array ball grid array) package measuring 10 mm x 10 mm. The chip is fully supported by an evaluation board, hands-free car kit application board and API software.
For more information, please visit
http://products.zarlink.com/profiles/ZL38003 .
About Zarlink Semiconductor
For over 30 years, Zarlink Semiconductor has delivered semiconductor solutions that drive the capabilities of voice, enterprise, broadband and wireless communications. The Company's success is built on its technology strengths including voice and data networks, optoelectronics and ultra low- power communications. For more information, visit www.zarlink.com .
Shareholders and other individuals wishing to receive, free of charge, copies of the reports filed with the U.S. Securities and Exchange Commission and Regulatory Authorities, should visit the Company's web site at www.zarlink.com or contact investor relations.
Certain statements in this press release constitute forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements involve known and unknown risks, uncertainties, and other factors which may cause the actual results, performance or achievements of the Company to be materially different from any future results, performance, or achievements expressed or implied by such forward-looking statements. Such risks, uncertainties and assumptions include, among others, the following: rapid technological developments and changes; our ability to achieve profitability and generate positive cash flows in the future; our exposure to product warranty claims resulting from product defects or failures; our dependence on our foundry suppliers and third-party subcontractors; increasing price and product competition; our exposure to currency exchange rate fluctuations and other factors inherent in our international operations; and other factors referenced in our Annual Report on Form 20-F for the fiscal year ended March 25, 2005. Investors are encouraged to consider the risks detailed in this filing.
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Semiconductor Inc.
CONTACT: Zarlink: Ed Goffin, Media Relations, (613) 270-7112, Email Contact
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